Direct Write Photolithography

We offer D.M.O MicroWriter ML3, a compact and high performance direct write photolithography machine, forml3
rapid prototyping in R&D.

This new generation machine is faster than ever before, thanks to the new exposure concept using LED light source, accurate Interferometer stage for high accuracy, on the fly selection of high resolution down to 0.6 microns and low resolution of 5 microns for big features exposures on the same job. Suitable for wafers up to 200mm and can process dies as well.

Many advanced features are offered as standard including:

  • Virtual mask aligner mode in which the pattern to be exposed is displayed on top of the real-time microscope image, allowing the machine to be used like a traditional mask aligner.
  • 0.6μm, 1μm, 2μm and 5μm resolutions across full writing area.
  • Automatic selection of resolution via software – no manual changing of lens required.
  • 385nm long-life semiconductor light source, suitable for broadband, g-, h- and i-line positive and negative photoresists (e.g. S1800, ECI-3000, MiR 701, SU-8).
  • XY interferometer stage for precise motion control.
  • Extremely fast writing speed - up to: 20mm2/minute (0.6μm resolution), 50mm2/minute (1μm resolution), 100mm2/minute (2μm resolution) and 180mm2/minute (5μm resolution). Autofocus system using yellow light which automatically tracks surface height variation during exposure, compensating for bowed or inclined substrates and surfaces with highly irregular topography. No minimum wafer size.
  • High quality infinite conjugate optical microscope camera with x3 aspheric objective lens and x5, x10 and x20 Olympus plan achromatic objective lens and yellow light illumination for alignment to lithographic markers on the wafer (±0.5μm 3σ alignment accuracy).
  • Automatic changing between microscope magnifications via software – no manual changing of lens required. Additional x4 digital zoom can be selected in software.
  • Grey scale exposure mode for 3-dimensional patterning (255 grey levels).
  • Built-in 2-dimensional optical surface profiler (100nm thickness resolution) for examining exposed resists, deposited layers, etching and other MEMS process steps.
  • Automatic wafer inspection tool allowing each die on a wafer to be imaged.
  • Includes passive vibration-isolation optical table with integrated monitor and keyboard mount.
  • Light-excluding enclosure with safety interlock.
  • Temperature stabilization to ±0.5⁰C

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