Phantom III Reactive Ion Etch (RIE)

 Tphantom iii reactive ion etch rie systemhe Phantom III RIE is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries. The system has a compact, modular design built on a space-saving platform. Samples of up to 300mm can be processed as well as dies and pieces.

 ICP option is offered for tight anisotropy in high aspect ratio structures and reduces microloading effect.


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